Qantek康泰克晶振,QC3CA26.0000F12B33R,通信应用晶振,美国进口晶振,Qantek晶振,康泰克晶振,型号:QC3CA,编码为:QC3CA26.0000F12B33R,频率为:26.000MHz,小体积晶振尺寸:3.2x2.5x1.1mm封装,四脚贴片晶振,石英晶振,3225晶振,无源晶振,石英晶体谐振器,无源谐振器,无铅环保晶振,SMD石英晶体,工作温度范围:-40℃至+85℃。具有超小型,轻薄型,高精度,高性能,高质量,高品质,耐热及耐环境等特点。高度低,适用于薄设备紧公差和稳定性可用,石英晶体,应用于:小型薄型设备,电信,无线网络,蓝牙模块,汽车电子,调制解调器、平板电脑,通信设备,测试设备,高密度应用。
Qantek康泰克晶振,QC3CA26.0000F12B33R,通信应用晶振参数表
| Frequency Range | 26.000 MHz |
| Frequency Tolerance at 25°C | ±20 to ±50ppm (±30ppm standard) |
| Frequency Stability over Temperature Range | See Stability vs. Temperature Table |
| Storage Temperature | -55 to +125°C |
| Aging per Year | ±5ppm max. |
| Load Capacitance CL | 10 to 32pF and Series Resonance |
| Shunt Capacitance C0 | 7.0pF max. |
| Equivalent Series Resistance (ESR) | See ESR Table |
| Drive Level | 100μW typ. (500μW max) |
| Insulation Resistance (MΩ) | 500 at 100Vdc ±15Vdc |
Qantek康泰克晶振,QC3CA26.0000F12B33R,通信应用晶振尺寸图
Qantek康泰克晶振,QC3CA26.0000F12B33R,通信应用晶振
产品特点:
外形尺寸:3.2mmx2.5mm贴片晶振
频率范围:12.000MHz~48.000MHz
全陶瓷环氧树脂密封SMD封装
高度低,适用于薄型设备
具有紧密的公差和稳定性
应用程序:高密度应用,调制解调器、通信和测试设备







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