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低功耗蓝牙智能灯控制模块耐高温晶振SG-210SCBA爱普生有源晶振X1G004591A09900

2022-09-27 14:38:56 统一电子

低功耗蓝牙智能灯控制模块耐高温晶振SG-210SCBA爱普生有源晶振X1G004591A09900
蓝牙智能照明奉加微PHY6202蓝牙芯片是一款具有强大性能,高灵活性的超低功耗芯片.同时支持低功耗蓝牙、蓝牙5.0、蓝牙MESH、ZigBee、谷歌Thread、Mist等多种通信协议,面向智能终端周边设备、智能语音、智能家居、智能制造、智能交通等应用爱普生晶振.PHY6202采用32位ARMCortex-M0内核,具有128KROM,138KSRAM,和256/512KFlash.其内置2.4GHz的无线收发机支持低功耗蓝牙（BLE）,ANT和私有2.4GHz协议栈.PHY6202可以作为独立系统运行,也可以作为主机MCU的从设备,通过I2C/UART接口提供蓝牙功能.

QQ截图20220927113716

SG-210SCBA爱普生有源晶振X1G004591A09900,低功耗蓝牙智能灯控制模块耐高温晶振

爱普生有源晶振编码 型号 频率 长X宽X高 输出波 电源电压 工作温度 频差
X1G004591A05800 SG-210SCBA 48.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A05900 SG-210SCBA 10.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A06700 SG-210SCBA 27.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A06800 SG-210SCBA 12.288000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A07200 SG-210SCBA 8.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A07300 SG-210SCBA 30.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A07700 SG-210SCBA 7.904000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A07800 SG-210SCBA 12.288000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A08100 SG-210SCBA 40.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A08200 SG-210SCBA 16.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-100ppm
X1G004591A08400 SG-210SCBA 24.576000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A08500 SG-210SCBA 16.666600MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A08600 SG-210SCBA 19.200000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A08700 SG-210SCBA 12.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A08800 SG-210SCBA 45.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A08900 SG-210SCBA 40.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A09000 SG-210SCBA 13.333000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A09100 SG-210SCBA 11.289600MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A09200 SG-210SCBA 12.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-100ppm
X1G004591A09400 SG-210SCBA 6.780000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A09500 SG-210SCBA 24.545452MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A09700 SG-210SCBA 48.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A09800 SG-210SCBA 11.250000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A09900 SG-210SCBA 12.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A10000 SG-210SCBA 16.666600MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A10100 SG-210SCBA 33.330000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-50ppm
X1G004591A10200 SG-210SCBA 10.240000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A10400 SG-210SCBA 24.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-100ppm
X1G004591A10500 SG-210SCBA 33.333000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A10600 SG-210SCBA 11.289600MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A10900 SG-210SCBA 6.144000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to85°C +/-100ppm
X1G004591A11000 SG-210SCBA 3.579000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A11100 SG-210SCBA 49.500000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A11400 SG-210SCBA 26.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A11500 SG-210SCBA 33.330000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
X1G004591A11800 SG-210SCBA 6.144000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to105°C +/-50ppm
X1G004591A11900 SG-210SCBA 4.000000MHz 2.50x2.00x0.90mm CMOS 2.700to3.600V -40to125°C +/-100ppm
泰凌微TLSR8269泰凌微物联网All-in-1芯片TLSR8269在单颗芯片上集成了射频、数字信号处理、协议栈软件和多个Profile,支持BluetoothSmart、BLEMesh、6LoWPAN、Thread、Zigbee、RF4CE、HomeKit以及2.4GHz专有标准.TLSR8269集成的512KBFLASH满足所有功能内置的需求,进口晶振终端产品功能可以通过软件进行配置.此外该芯片还可以耐高温达125摄氏度,特别适合在LED照明领域采用.
上海巨微MG1751是一颗紧凑型BLE透传芯片,支持广播/透传,支持长包数据和AES加密,符合BLE5.0核心规范.适合于灯控,透传等应用.

SG-210SCBA爱普生有源晶振X1G004591A09900,低功耗蓝牙智能灯控制模块耐高温晶振

QQ截图20220927143107

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