低功耗蓝牙智能灯控制模块耐高温晶振SG-210SCBA爱普生有源晶振X1G004591A09900
低功耗蓝牙智能灯控制模块耐高温晶振SG-210SCBA爱普生有源晶振X1G004591A09900
蓝牙智能照明奉加微PHY6202蓝牙芯片是一款具有强大性能,高灵活性的超低功耗芯片.同时支持低功耗蓝牙、蓝牙5.0、蓝牙MESH、ZigBee、谷歌Thread、Mist等多种通信协议,面向智能终端周边设备、智能语音、智能家居、智能制造、智能交通等应用爱普生晶振.PHY6202采用32位ARM Cortex-M0内核,具有128K ROM,138K SRAM,和256/512KFlash.其内置2.4GHz的无线收发机支持低功耗蓝牙（BLE）,ANT和私有2.4GHz协议栈.PHY6202可以作为独立系统运行,也可以作为主机MCU的从设备,通过I2C/UART接口提供蓝牙功能.
SG-210SCBA爱普生有源晶振X1G004591A09900,低功耗蓝牙智能灯控制模块耐高温晶振
泰凌微TLSR8269泰凌微物联网All-in-1芯片TLSR8269在单颗芯片上集成了射频、数字信号处理、协议栈软件和多个Profile,支持Bluetooth Smart、BLE Mesh、6LoWPAN、Thread、Zigbee、RF4CE、HomeKit以及2.4GHz专有标准.TLSR8269集成的512KB FLASH满足所有功能内置的需求,进口晶振终端产品功能可以通过软件进行配置.此外该芯片还可以耐高温达125摄氏度,特别适合在LED照明领域采用.
爱普生有源晶振编码
型号
频率
长X宽X高
输出波
电源电压
工作温度
频差
X1G004591A05800
SG-210SCBA
48.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A05900
SG-210SCBA
10.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A06700
SG-210SCBA
27.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A06800
SG-210SCBA
12.288000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A07200
SG-210SCBA
8.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A07300
SG-210SCBA
30.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A07700
SG-210SCBA
7.904000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A07800
SG-210SCBA
12.288000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A08100
SG-210SCBA
40.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A08200
SG-210SCBA
16.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-100 ppm
X1G004591A08400
SG-210SCBA
24.576000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A08500
SG-210SCBA
16.666600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A08600
SG-210SCBA
19.200000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A08700
SG-210SCBA
12.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A08800
SG-210SCBA
45.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A08900
SG-210SCBA
40.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A09000
SG-210SCBA
13.333000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A09100
SG-210SCBA
11.289600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A09200
SG-210SCBA
12.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-100 ppm
X1G004591A09400
SG-210SCBA
6.780000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A09500
SG-210SCBA
24.545452 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A09700
SG-210SCBA
48.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A09800
SG-210SCBA
11.250000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A09900
SG-210SCBA
12.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A10000
SG-210SCBA
16.666600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A10100
SG-210SCBA
33.330000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A10200
SG-210SCBA
10.240000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A10400
SG-210SCBA
24.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-100 ppm
X1G004591A10500
SG-210SCBA
33.333000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A10600
SG-210SCBA
11.289600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A10900
SG-210SCBA
6.144000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-100 ppm
X1G004591A11000
SG-210SCBA
3.579000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A11100
SG-210SCBA
49.500000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A11400
SG-210SCBA
26.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A11500
SG-210SCBA
33.330000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A11800
SG-210SCBA
6.144000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A11900
SG-210SCBA
4.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
上海巨微MG1751是一颗紧凑型BLE透传芯片,支持广播/透传,支持长包数据和AES加密,符合BLE5.0核心规范.适合于灯控,透传等应用.
SG-210SCBA爱普生有源晶振X1G004591A09900,低功耗蓝牙智能灯控制模块耐高温晶振
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